Substrates

Substrates are specialized base materials used to support, connect, and integrate electronic, mechanical, and functional components in advanced industrial systems. They serve as the foundational platform on which conductive structures, circuits, sensors, coatings, and multilayer assemblies are built.

High-performance substrates are designed to provide excellent dimensional stability, thermal resistance, chemical resistance, and electrical reliability under demanding operating conditions. Depending on the application, substrates may support technologies such as laser structuring, lithography, electroplating, wire bonding, coating processes, and semiconductor manufacturing.

PEEK LDS Black is an advanced film substrate developed for Laser Direct Structuring (LDS) applications, providing a precise and flexible solution for complex microsystem and electronic structures. The material expands design possibilities for high-performance substrate production in demanding industrial environments.

The substrate enables highly precise structuring and supports direct VIAs (Vertical Interconnect Access), allowing greater design flexibility and enhanced functionality within compact electronic layouts. It combines excellent surface quality, thermal performance, and chemical resistance, making it suitable for advanced manufacturing applications requiring reliability and dimensional stability.

Designed for efficient roll-to-roll manufacturing, the substrate supports high-speed, cost-effective production of flexible structures. By reducing the need for additional insulation layers and minimizing processing complexity, the material enables more resource-efficient manufacturing compared with conventional substrate fabrication methods. Compatibility with advanced processing techniques further contributes to optimized production efficiency and lower manufacturing effort.

The substrate also supports environmentally conscious manufacturing through simplified structuring methods and recyclable material characteristics. It is particularly suitable for multilayer systems, interposers with deep structures, deep-drawable antenna applications, and integrated layers on additional substrate systems.

PEEK LDS Grey is an advanced LDS-capable film substrate developed for flexible and high-precision industrial applications requiring complex structures, reliable performance, and enhanced design flexibility. This grey substrate variant offers the same core performance characteristics expected from high-performance LDS film substrates while expanding material options for specialized technical applications.

The substrate delivers excellent thermal stability, strong chemical resistance, and high surface quality, making it suitable for demanding manufacturing environments and precision electronic applications. Its material formulation is biocompatible, supporting suitability for applications requiring compatibility with medical and healthcare-related environments.

Designed as a resource-efficient alternative to conventional film substrate technologies, the material supports efficient and sustainable manufacturing processes while maintaining excellent dimensional stability and long-term performance under challenging operating conditions.

The substrate is compatible with advanced processing and structuring technologies, enabling precise production of multilayer systems, electronic assemblies, sensors, and other high-performance industrial components.

PEEK LDS Black is an advanced 4-inch substrate manufactured from high-performance PEEK material and developed as an alternative to conventional substrate materials used in microsystems, electronics, and sensor technologies. The wafer substrate combines excellent thermal, electrical, and mechanical properties, making it suitable for demanding industrial and precision engineering applications.

With its low thermal conductivity, the substrate is highly suitable for temperature sensing applications, heating elements, and thermal management systems. Its high elasticity also supports applications requiring pressure sensitivity and mechanical flexibility.

The substrate demonstrates excellent resistance to aggressive environments together with high dielectric strength, enabling reliable performance under challenging operating conditions. Flexible processing options including laser cutting, milling, and drilling allow easy adaptation to specific application requirements and custom component geometries.

The material supports optimized manufacturing workflows by reducing the need for additional insulation layers. It is also compatible with conventional lithography and PVD coating processes, enabling efficient production of advanced microsystems and precision electronic structures. Recyclable material characteristics and streamlined processing contribute to more resource-efficient manufacturing.

The substrate offers excellent surface quality, with surface roughness ranging from 20 to 50 nm and the potential for ultra-fine finishes below 10 nm using specialized processing methods. Flatness ranges from 50 to 100 µm across a 100 mm diameter, while available thicknesses range from 0.9 mm to 1.5 mm. With temperature resistance up to 250 °C and dielectric strength of 17.5 kV/mm, the substrate is particularly suitable for sensing technologies, high-frequency applications, and advanced microsystem integration.

PEEK LDS Grey is an advanced wafer substrate developed for microsystems, electronics, and sensor technologies, delivering the same high-performance characteristics expected from advanced PEEK-based substrate materials while expanding design flexibility through a grey material variant. The substrate supports demanding industrial applications requiring precision, thermal stability, and reliable long-term performance.

The material combines excellent thermal, electrical, and mechanical properties, making it suitable for advanced microsystem structures, sensor platforms, semiconductor environments, and precision electronic applications. Its biocompatible formulation also supports suitability for applications requiring compatibility with medical and healthcare-related environments.

The substrate provides excellent surface quality, strong chemical resistance, low moisture absorption, and stable performance under challenging operating conditions. Compatibility with advanced manufacturing and structuring processes enables efficient production of precision components, multilayer systems, and highly functional electronic assemblies.

Its high-performance material profile supports flexibility in design, functional integration, and customization for complex microsystem and industrial applications.