Sintered Plastics

TECASINT 4111 natural is a high-performance unfilled polyimide material engineered for extremely demanding thermal, mechanical, and semiconductor applications. Compared to other materials in the TECASINT family, the 4100 series delivers exceptionally high thermal stability, extremely low moisture absorption, superior rigidity, and outstanding oxidative stability. The material also offers enhanced chemical resistance, excellent electrical insulation, and very low outgassing performance, making it highly suitable for precision and vacuum-sensitive applications.

This advanced PI material exhibits an exceptionally high heat deflection temperature of up to 470 °C (HDT/A), while maintaining excellent stiffness and dimensional stability even at elevated temperatures up to 400 °C. Its high flexural modulus and low elongation characteristics enable superior bending resistance, reduced burr formation during machining, and exceptional precision in tight-tolerance manufacturing processes.

TECASINT 4111 natural is part of Ensinger’s semiconductor-grade portfolio and is manufactured under stringent contamination controls with copy-exact compliance. Due to its excellent dimensional stability, low CLTE, high purity, and low outgassing characteristics in accordance with ESA regulation ECSS-Q-70-02, the material is widely used in semiconductor manufacturing equipment, IC test sockets, electronic fixtures, and plasma etching vacuum chamber components.

2: TECASINT 2011 natural

Unfilled Polyimide

TECASINT 2011 natural is a high-performance unfilled polyimide material designed for demanding thermal, mechanical, aerospace, and semiconductor applications. This advanced PI grade offers an exceptional combination of rigidity, hardness, toughness, and dimensional stability, making it highly suitable for precision-engineered components operating under extreme conditions.

Compared to TECASINT 1011, TECASINT 2011 natural provides significantly lower moisture absorption, improved toughness, and superior machinability. Within the TECASINT 2000 product family, it delivers the highest strength and elongation values while maintaining a very high modulus of elasticity and minimal thermal and electrical conductivity. These characteristics allow the material to maintain excellent dimensional accuracy and reliable mechanical performance even in thermally demanding environments.

The material also features high purity and very low outgassing in accordance with ESA regulation ECSS-Q-70-02, making it particularly suitable for aerospace, vacuum, cryogenic, and semiconductor-related applications where contamination control is critical.

TECASINT 4011 natural is a high-performance unfilled polyimide material developed for demanding semiconductor, precision engineering, and high-temperature industrial applications. Compared to other TECASINT materials, the TECASINT 4000 series offers exceptionally low moisture absorption, excellent oxidative stability, improved chemical resistance, and enhanced dimensional stability under thermal stress.

Despite its high strength, TECASINT 4011 natural also provides excellent toughness and high elongation at break. The material demonstrates significantly improved rigidity and modulus compared to conventional polyimides at temperatures up to 260 °C. In addition, it delivers excellent thermal and electrical insulation properties along with high purity and low outgassing performance according to ESA regulation ECSS-Q-70-02.

As part of Ensinger’s semiconductor-grade portfolio, TECASINT 4011 natural is produced under strict contamination controls with copy-exact compliance, ensuring outstanding quality consistency and cleanliness. The balanced combination of stiffness and ductility allows reduced burr formation, deformation, and cracking during micro-machining operations, making it highly suitable for IC test sockets, electronic fixtures, and semiconductor manufacturing equipment components.

Its excellent dimensional stability, low outgassing behaviour, and high temperature resistance also make the material ideal for plasma etching vacuum chamber applications and other precision semiconductor systems.

TECASINT 6022 black is a high-performance graphite-modified polyimide material developed from the base polymer TECASINT 6012 natural and specifically optimized for demanding tribological applications. As part of Ensinger’s TECASINT 6000 series, this material is processed using the direct forming process, enabling efficient production of precision components designed for extreme operating conditions.

The graphite modification significantly improves wear resistance, heat ageing performance, and sliding characteristics, making the material highly suitable for both lubricated and dry-running applications. TECASINT 6022 black exhibits outstanding friction and wear behaviour even under elevated temperatures, pressures, and speeds where conventional engineering plastics typically fail.

Due to its exceptional thermal resistance, high creep resistance, and low thermal expansion, this PI material is commonly used for sliding bushings, bearings, seals, and other tribological components operating in highly demanding industrial environments.

TECASINT 4021 black is a graphite-filled polyimide material developed from the base polymer TECASINT 4011 natural and enhanced with 15% graphite to improve tribological performance. The addition of graphite significantly enhances the material’s friction and wear properties, making it highly suitable for demanding sliding and dry-running applications.

This self-lubricating PI material combines excellent thermal stability, low moisture absorption, high creep resistance, and outstanding wear behaviour under mechanical stress. TECASINT 4021 black is particularly effective in applications requiring reliable performance at elevated temperatures while maintaining dimensional stability and long-term mechanical integrity.

Its excellent resistance to thermal ageing, chemicals, and high-energy radiation further supports its use in precision engineering, conveyor systems, and high-temperature industrial environments.

TECASINT 5111 natural is a high-performance unfilled polyimide material engineered for applications requiring exceptional thermal stability, high creep resistance, and reliable mechanical performance under extreme operating conditions. As a non-melting polymer, this PI material offers continuous service temperatures up to 300 °C, significantly exceeding the capabilities of many conventional high-performance plastics such as PEEK or PPS.

The material combines low thermal expansion with excellent dimensional stability, making it ideal for components exposed to continuous thermal and mechanical stress. TECASINT 5111 natural also provides very good electrical insulation properties, good wear resistance, and strong resistance to high-energy radiation, enabling reliable use in highly demanding technical environments.

In addition to its thermal performance, the material demonstrates good chemical resistance against light acids and many organic solvents. These characteristics make TECASINT 5111 natural highly suitable for semiconductor technology, aerospace systems, electrical engineering, cryogenic applications, and vacuum environments.

TECASINT 5501 ESD light-brown is an electrically modified polyimide material developed from TECASINT 5111 natural and engineered for demanding applications requiring reliable electrostatic dissipation. By incorporating special conductive additives, the material achieves a defined surface resistance range of 10⁶–10⁸ ohms, making it highly suitable for ESD-sensitive environments within semiconductor, electronics, and precision engineering industries.

Like all TECASINT polyimide materials, TECASINT 5501 ESD light-brown demonstrates exceptional resistance to thermal and mechanical stress. The material offers a glass transition temperature of 329 °C and a short-term service temperature up to 300 °C while maintaining excellent creep resistance and dimensional stability under elevated operating conditions.

The material also features very low thermal expansion, high surface hardness, excellent stiffness, and resistance against high-energy radiation. These properties make TECASINT 5501 ESD light-brown particularly suitable for semiconductor manufacturing equipment, electronics handling systems, cryogenic applications, and vacuum environments where controlled electrostatic dissipation is critical.

TECASINT 5511 SD light-brown is an electrically modified polyimide material based on TECASINT 5111 natural and developed for applications requiring controlled electrostatic dissipation under demanding operating conditions. The material provides a defined surface resistivity range between 10⁹ and 10¹¹ ohms, enabling slower and more controlled static charge dissipation compared to conventional ESD materials.

This SD polyimide grade offers the same outstanding thermal and mechanical properties as TECASINT 5501 ESD light-brown, including excellent creep resistance, low thermal expansion, and superior dimensional stability. Its balanced electrical characteristics make it highly suitable for sensitive semiconductor and electronics applications where a slower dissipation rate or higher surface resistance is preferred.

TECASINT 5511 SD light-brown is commonly used for workpiece carriers, adapter components, and handling systems designed for delicate semiconductor and electronic components operating in highly controlled manufacturing environments.

TECASINT 4121 black is a graphite-filled polyimide material based on the high-performance base polymer TECASINT 4111 natural and enhanced with 15% graphite to improve tribological performance. The graphite modification significantly improves friction and wear characteristics, making the material highly suitable for demanding sliding and dry-running applications.

This self-lubricating PI material combines outstanding thermal stability, extremely low moisture absorption, high creep resistance, and excellent dimensional stability under thermal stress. TECASINT 4121 black is particularly effective in tribological applications operating at elevated temperatures where reliable wear performance and long-term mechanical stability are essential.

Its excellent resistance to chemicals, thermal ageing, and high-energy radiation further supports its use in precision engineering, conveyor systems, automotive components, and hot glass handling applications.

TECASINT 2391 black is a high-performance polyimide material based on the TECASINT 2011 base polymer and modified with 15% molybdenum disulfide (MoS₂) to enhance tribological performance under vacuum and technically dry operating conditions. The addition of MoS₂ significantly improves friction and wear behaviour, making the material particularly suitable for aerospace, vacuum, and cryogenic applications where conventional lubricants are ineffective or unsuitable.

This advanced PI material demonstrates outstanding sliding and wear properties together with excellent thermal stability, high creep resistance, and strong mechanical performance under demanding environmental conditions. TECASINT 2391 black also provides low outgassing behaviour in accordance with ESA regulation ECSS-Q-70-02, supporting its suitability for vacuum-sensitive and aerospace-related systems.

Due to its reliable tribological performance in inert gases, vacuum environments, and space-related applications, the material is widely used in precision engineering systems requiring long-term dimensional stability and reduced wear under extreme operating conditions.

TECASINT 6032 black is a highly filled graphite-modified polyimide material from Ensinger’s TECASINT 6000 series, developed specifically for demanding high-temperature and tribological applications. Like all materials in the 6000 series, TECASINT 6032 black is based on a non-meltable polyimide polymer and is processed exclusively using the direct forming process, allowing cost-effective production of precision components for extreme operating environments.

The material delivers exceptional thermal stability, excellent wear resistance, and very good bearing properties, making it particularly suitable for hot glass handling applications. Its combination of high temperature resistance, low thermal conductivity, and outstanding wear behaviour helps increase service life, improve productivity, and reduce scrap rates in glass manufacturing operations.

TECASINT 6032 black is commonly used in the production of glass bottles, cosmetic packaging, pharmaceutical containers, and other precision hot glass handling systems. Compared to traditional graphite components, the material offers improved fracture strength, higher toughness, lower oil absorption, and cleaner machinability without dust formation.

Its low thermal expansion and excellent dimensional stability also make it highly suitable for tribological applications in aerospace, automotive, and precision mechanical engineering systems operating under thermal stress.

TECASINT 1011 natural is a high-performance unfilled polyimide material recognized within the TECASINT 1000 product family for its exceptional strength, high elongation, and outstanding thermal stability. Formerly known as SINTIMID Pur HT, this advanced PI material combines very high rigidity, hardness, and modulus of elasticity with low thermal and electrical conductivity, making it highly suitable for demanding precision engineering and aerospace applications.

The material also offers high purity and low outgassing characteristics in accordance with ESA regulation ECSS-Q-70-02, supporting its use in vacuum-sensitive and aerospace-related environments. TECASINT 1011 natural maintains excellent dimensional stability and mechanical integrity under extreme thermal and mechanical stress while also delivering very good electrical insulation properties.

Its combination of thermal resistance, creep resistance, radiation resistance, and chemical stability makes TECASINT 1011 natural an ideal solution for semiconductor systems, cryogenic engineering, electrical insulation components, and high-performance mechanical applications.

TECASINT 1021 black is a graphite-filled polyimide material developed from the base polymer TECASINT 1011 natural and modified with 15% graphite to enhance tribological performance. The graphite reinforcement significantly improves friction and wear behaviour, making the material highly suitable for demanding sliding applications operating under thermal and mechanical stress.

This self-lubricating PI material performs effectively in both lubricated and dry-running environments while maintaining excellent thermal stability, wear resistance, and dimensional integrity. TECASINT 1021 black also provides strong creep resistance, good chemical stability, and resistance against high-energy radiation, enabling reliable long-term performance in challenging industrial conditions.

Due to its balanced combination of mechanical strength, thermal stability, and tribological efficiency, the material is widely used in aerospace systems, precision engineering, automotive applications, conveyor technology, and hot glass handling environments.

TECASINT 2021 black is a graphite-reinforced polyimide material based on the TECASINT 2011 base polymer and modified with 15% graphite to optimize friction and wear performance for tribological applications. The material is specifically engineered to deliver reliable sliding behaviour under both lubricated and dry-running conditions.

Its self-lubricating properties, combined with excellent thermal stability, wear resistance, and high creep resistance, make TECASINT 2021 black highly suitable for demanding industrial environments exposed to continuous thermal and mechanical stress. The material also demonstrates good chemical resistance and resistance against high-energy radiation, ensuring long-term operational reliability.

TECASINT 2021 black is widely used in aerospace technology, precision engineering, conveyor systems, hot glass handling equipment, and automotive components requiring stable tribological performance and dimensional stability.

TECASINT 2031 black is a highly graphite-filled polyimide material based on the TECASINT 2011 base polymer and enhanced with 40% graphite for superior tribological and thermal performance. The high graphite content significantly improves self-lubrication, wear resistance, and thermal ageing resistance while also minimizing thermal expansion for enhanced dimensional stability.

This advanced PI material is specifically designed for applications requiring low thermal elongation, excellent creep resistance, and reliable sliding behaviour under demanding thermal and mechanical operating conditions. TECASINT 2031 black maintains excellent thermal stability and mechanical integrity even during prolonged exposure to elevated temperatures.

Its combination of outstanding wear performance, low thermal expansion, and high dimensional stability makes the material highly suitable for aerospace systems, automotive engineering, hot glass technology, conveyor systems, and precision mechanical applications.

TECASINT 1031 black is a highly graphite-filled polyimide material developed from the TECASINT 1011 base polymer and reinforced with 40% graphite to significantly improve tribological and thermal performance. The high graphite content enhances self-lubricating behaviour, improves resistance to thermal ageing, and minimizes thermal expansion for superior dimensional stability under demanding operating conditions.

This advanced PI material demonstrates outstanding sliding and wear properties together with very high creep resistance and strong mechanical stability at elevated temperatures. Its low thermal elongation characteristics allow precision components to maintain dimensional accuracy even during prolonged exposure to thermal and mechanical stress.

TECASINT 1031 black is particularly suitable for demanding industrial and aerospace applications requiring reliable tribological performance, reduced wear, and high dimensional stability. The material is commonly used in conveyor systems, hot glass handling equipment, precision mechanical components, textile machinery, and cryogenic engineering systems.

TECASINT 6012 natural is a non-meltable, highly temperature-resistant polyimide material developed for demanding industrial applications requiring exceptional thermal stability and long-term mechanical reliability. As the unfilled grade within Ensinger’s TECASINT 6000 series, this material is processed exclusively using the direct forming process, enabling cost-effective manufacturing of high-volume precision components designed for extreme operating conditions.

The material exhibits outstanding creep resistance and demonstrates virtually no tendency to creep compared to conventional thermoplastics. TECASINT 6012 natural also provides low outgassing performance in vacuum environments, excellent chemical resistance, and resistance against high-energy radiation, making it highly suitable for aerospace, semiconductor, and vacuum-related systems.

Due to its low thermal conductivity and excellent electrical insulation properties, the material performs exceptionally well in highly stressed insulating applications within electrical engineering and semiconductor technology. TECASINT 6012 natural also retains reliable mechanical and thermal performance under cryogenic conditions down to -273 °C.

TECASINT 6062 black is a graphite and PTFE modified polyimide material developed from TECASINT 6012 natural and optimized specifically for demanding tribological applications requiring excellent sliding behaviour at elevated temperatures and moderate PV values. Like other materials in the TECASINT 6000 series, it is processed exclusively using the direct forming process for cost-effective production of high-performance precision components.

The combination of graphite and PTFE fillers provides exceptionally low static friction and excellent slip-stick behaviour, making TECASINT 6062 black particularly suitable for low-speed sliding systems where stick-slip effects must be minimized. Its self-lubricating characteristics enable reliable operation in dry-running applications without the need for external lubrication.

The material also offers excellent chemical resistance, resistance against high-energy radiation, and stable tribological performance under demanding thermal and mechanical conditions, supporting its use in aerospace, automotive, and advanced mechanical engineering applications.

TECASINT 1061 black is a tribologically optimized polyimide material based on the TECASINT 2011 base polymer and modified with 15% graphite and 10% PTFE to achieve exceptionally low friction and improved wear behaviour. This advanced PI material is specifically engineered for low-friction and low-wear applications operating under moderate temperatures below 200 °C and medium mechanical loads.

The combination of graphite and PTFE fillers provides very low static friction and a reduced coefficient of friction while enabling reliable self-lubricating performance in dry-running environments. TECASINT 1061 black demonstrates excellent sliding and wear characteristics together with strong mechanical stability and good chemical resistance.

Its balanced tribological properties make the material highly suitable for precision engineering systems, conveyor technology, textile machinery, vacuum environments, and aerospace applications requiring reliable sliding performance without external lubrication.